(內容請參閱英文版)
Overheating is an emerging critical challenge across electric vehicles, AI and supercomputing, low-altitude aircraft, and other sectors reliant on high-power semiconductors. Dynano addresses this with a series of advanced thermal management materials and innovative packaging designs for high-power semiconductor systems. Its integrated technology boosts system performance while extending operational lifetime, enabling safer, more reliable high-power applications.
Principal Investigator(s)
Prof. Mingxin HUANG
Professor, Chair of Materials Technology
Department of Mechanical Engineering
Faculty of Engineering
Email: mxhuang@hku.hk
